Golden laser invitat te APFE Shanghai

Et 20 Shanghai Internationalis Tape & Duis Expo & 20 Shanghai International Die-Cutting Expo, APFAT, in Pioneer of Global tenaces tapes et films Prohibition, erit tenuit in 3-5 June MMXXIV ad Shanghai National et Convention Center. Quarto huius exhibitionem aestimatur ut 53.000 quadratum metris, cum 2,600 International Latin Vulgate, et quod expectat colligere plus quam CM Chinese et in altis notam exhibitionem et confirma tapes et films.

APFE is composed of three sections: new adhesive materials (adhesive tapes, protective films, adhesive labels, release materials), functional films (functional protective films, optical films, automotive films, new energy films, glass films, films for home appliances/electrical appliances, packaging films, etc.), and die-cutting materials (foams, shielding/heat-conducting, insulating / faciendi, waterproofing / Signaing, inpulsa-absorbing / Cushioning, etc. Rolls / CUMATIUM Materials). Relying on 53,000 square metres of strong large-scale lineup, comprehensive layout of the two large halls (1.1H, 2.1H), will gather 900 + brand-name enterprises at home and abroad, one-stop full of all kinds of new adhesive materials, functional film and die-cutting materials, as well as related manufacturing and processing technology and equipment, for more than 39,500 domestic and international applications and die-cutting industry and processors, Agents / Distributors et Alius professional buyers providere a platform ad commercia et technica commutationibus. et technica commutationem suggestus.

Golden laser est excitatur ad nuntiare suum participationem in ventura 20th Shanghai International Tape & film expo (die-secans turpis), accedant ad locum a June 3-5, MMXXIV, ad Shanghai National Pre se ferre et conventu centrum. Ut a duce in laser secans technology, aurea laser erit praesens tria suae maxime provectuslaser mori secare machinisIn hac premier industria eventu.

Et Highlight of Golden laser est exhibent erit demonstrationem de his publica-of-in-arte machinis:

LC230 volumine-to-volumine laser mori-secans apparatus: Hoc apparatus est disposito eximia praecisione et efficientiam in volumine-to-volumine applications, providing summus qualitas et consistent results pro variis mori-cutting necessitates. Eius innovative technology ensures lenis et accurate cuts, faciens illud a summo arbitrium pro manufacturers.

JMSJG Series CRAECTICIFICATIO laser CAESUS Machina: Nomenned pro eius egregius accurate, in JMSJG series perfectum est intricatus et detailed secare tasks. Hoc machina est machina tractare maxime delicata materiae cum praecisione, occurrens summum signa requiritur ad universa consilia et applications.

LC-3550Jg volumine pascebat praecisione laser mori-secans apparatus: Hoc versatile apparatus combines volumine materia tractantem cum praecisione laser mori, secans, offering innumerabilis perficientur ad amplis materiae. Et LC-3550Jg est disposito augendae productivity et praecisione, faciens illud inuestigatione dignissim diversis industriae applications.

Golden laser invitationes omnibus attendees visitare eorum umbraculum ad testimonium vivere demonstrationes harum sectionem-ore machinis. In comitatu scriptor quadrigis et peritorum erit praesto providere in-profundum notitia, respondere quaestiones, et de quomodo Golden laser scriptor innovative solutions potest occursum specifica necessitatibus variis industries.

Haec expo providet a unique occasionem ad professionals ad experiri ad tardus progressiones in laser secans technology et intelligere quomodo aureus laser scriptor products potest amplio efficientiam et praecisionem in operationibus.

Adiungere Golden laser ad 20 Shanghai International Tape & film expo ad explorandum futurum laser secans technology.

Res Details:

Pre se ferre: et 20 Shanghai Internationalis tape & film turpis (Die-Cutting Expo)
Date: June 3-5, MMXXIV
Location: Shanghai National Exhibition et Convention Center

Aurea laser vultus deinceps ad excipiendam industria professionales et showcasing transformative capabilities de eius latest laser mori-cutting technology.