2021 SHENZHEN
FILM & TAPE EXPO
2021.10.19-21
GOLDENLASER
Booth No. 1V28
From 19 to 21 October 2021, FILM & TAPE EXPO 2021 will be grandly held at Shenzhen Convention & Exhibition Center with the theme of "Film Innovation, Adhesive Linking Everything".
With 60,000 square meters of exhibition space, the event will bring together the elites of the whole industry chain; 800+ famous exhibitors will be able to keep abreast of the latest international and domestic film tape trends and business models, helping 40,000 professional visitors to gain insight into the latest trends in the film and tape industry and get a head start.
As one of the key equipment exhibitors at the show, Goldenlaser will bring its latest laser die-cutting technology and solutions to booth 1V28 and welcome visitors to negotiate and exchange ideas.
FILM & TAPE EXPO is a professional trade show focused on showcasing a comprehensive line-up of functional film and tape products and associated equipment to the high value-added application sectors. Over the past 15 years of development, we have built up a huge database of 200,000 high quality industry buyers. In our upcoming annual gala in 2021, we will expect to welcome an influx of approximately 40,000 domestic and overseas technical R&D personnel, professional buyers, and corporate executives visiting our onsite venue, in addition, an even larger contingent of industry professionals will be visiting our second cyber expo space. They come from such sectors and fields as die-cutting, touchscreen/ display panel, cell phone/ tablet, backlight module, FPC, household electrical appliance, auto accessory, medtronics and beauty-care, photovoltaic/ energy storage and so forth. With the benefits of our exclusive TAP Buyer scheme introduced by RX, back-to-back business matching and comprehensive brand promotion services are available to help exhibitors to rollout new products, build up brand image, expand customer base, clinch business deals, as well as serving as a face-to-face interaction and business platform.