Yintoni iDie Cutting?

I-die-cutting yendabuko ibhekisela kwinkqubo yokusika emva kokulungiswa kwezinto eziprintiweyo. Inkqubo yokusikwa ivumela izinto eziprintiweyo okanye ezinye iimveliso zephepha ukuba zisikwe ngokuhambelana nomzobo owenziwe kwangaphambili ukuvelisa ipleyiti yokusika imela, ukwenzela ukuba imilo yezinto eziprintiweyo azisekho kuphela kwimida ethe tye kunye neekona. Iimela eziqhelekileyo zokufa zihlanganiswe kwisitya sokufa esisekelwe kumzobo ofunekayo kuyilo lwemveliso. I-Die-cutting yinkqubo yokwenza apho ukuprintwa okanye elinye iphepha lisikwa kwimilo efunwayo okanye uphawu lokusika phantsi koxinzelelo. Inkqubo ye-creasing isebenzisa i-creasing imela okanye i-creasing die ukucinezela uphawu lomgca kwiphepha ngoxinzelelo, okanye i-roller ukuqengqeleka uphawu lomgca kwiphepha ukwenzela ukuba ishidi ligobe kwaye lenziwe kwindawo enqunywe kwangaphambili.

Njengeishishini lombaneiyaqhubeka ukukhula ngokukhawuleza, ngakumbi ngoluhlu olwandayo lweemveliso ze-elektroniki zabathengi, ukunqunyulwa kwe-die-cutting akukhawulelwanga kuphela emva kokulungiswa kweemveliso eziprintiweyo (umzekelo, iilebhile), kodwa yindlela yokuvelisa.izixhobo ezincedisayo kwimizi-mveliso ye-elektroniki. Ngokuqhelekileyo isetyenziswe kwi: i-electro-acoustic, ukunakekelwa kwezempilo, ukuveliswa kwebhetri, iimpawu zokubonisa, ukhuseleko kunye nokukhusela, ukuthutha, iimpahla zeofisi, i-electronics kunye namandla, unxibelelwano, ukuveliswa kwamashishini, ukuzonwabisa ekhaya kunye namanye amashishini. Isetyenziswe kwiifowuni eziphathwayo, i-MID, iikhamera zedijithali, i-automotive, i-LCD, i-LED, i-FPC, i-FFC, i-RFID kunye neminye imiba yemveliso, ngokuthe ngcembe isetyenziswe kwiimveliso ezingentla zokudibanisa, i-dustproof, i-shockproof, i-insulation, ukukhusela, i-thermal conductivity, ukhuseleko lwenkqubo, njl. Izinto ezisetyenziselwa ukusika i-die-cutting ziquka irabha, iiteyiphu zokuncamathela ezisecaleni kunye namacala amabini, amagwebu, iplastiki, ivinyl, isilicon, iifilimu zamehlo, ezikhuselayo. iifilimu, i-gauze, iiteyiphu ezishushu ezinyibilikayo, i-silicone, njl.

Umatshini wokusika wokufa

Izixhobo eziqhelekileyo zokusika ukufa zihlulwe zibe ziindidi ezimbini: omnye ngumatshini omkhulu wokusika osetyenziswa ngobuchwephesha kwibhokisi kunye nokupakishwa kwebhokisi yemibala, kwaye enye ngumatshini wokusika osetyenziselwa ukuchaneka kweemveliso zombane. Eyona nto ifanayo zombini kukuba ziimveliso zokugqobhoza ngokukhawuleza, zombini zifuna ukusetyenziswa kwesikhunta, kwaye zizixhobo ezibalulekileyo eziyimfuneko kwiinkqubo zanamhlanje. Iinkqubo ezahlukeneyo zokusika ukufa zonke zisekelwe kumatshini wokufa, ngoko ke umatshini wokufa, ohambelana ngokusondeleyo nathi, yeyona nto ibalulekileyo yokufa.

Iintlobo eziqhelekileyo zomatshini wokusika iifa

I-Flatbed Die Cutting Machine

I-Flatbed die-cutting yeyona ndlela ixhaphakileyo yokusika ukufa ngokwesiko. Indlela yokwenza iprofayili "yentsimbi yentsimbi" ngokweenkcukacha zomthengi, kwaye usike iinxalenye ngokufaka isitampu.

Rotary Die Cutting Machine

I-Rotary die-cutting isetyenziselwa ubukhulu becala ukusika iwebhu. I-Rotary die-cutting isetyenziselwa izinto ezithambileyo ukuya kwi-semi-rigid, apho izinto zicinezelwe phakathi kwe-cylindrical die kunye ne-melade blade kwi-anvil ye-cylindrical ukufezekisa ukusikwa. Le fomu idla ngokusetyenziswa kwi-liner die-cutting.

Laser Die Cutting Machine

Xa kuthelekiswa noomatshini abaqhelekileyo bokusika,oomatshini laser die-ukusikaluhlobo lwanamhlanje lwezixhobo zokusika kwaye lukhetho olukhethwayo kwiiprojekthi ezifuna indibaniselwano eyodwa yesantya kunye nokuchaneka. Oomatshini bokusika beLaser bafaka umqadi welaser ogxile ngamandla ukusika izinto ngokungenamthungo zibe luluhlu olungenasiphelo lwamacandelo anayo nayiphi na imilo okanye ubungakanani. Ngokungafaniyo nezinye iintlobo zokusika “zokufa”, inkqubo yelaser ayisebenzisi ukufa ngokwasemzimbeni.

Ngokwenyani, i-laser ikhokelwa kwaye ilawulwa yikhompyuter phantsi kwemiyalelo yoyilo eyenziwe yiCAD. Ukongeza ekunikezeni ukuchaneka okuphezulu kunye nesantya, ii-laser die cutters zifanelekile ekudaleni ukusikwa okukodwa okanye iiprototypes zokuqala.

Oomatshini bokusika i-Laser nabo bagqwesileyo kwizixhobo zokusika ezinye iintlobo zoomatshini bokusika azikwazi ukuphatha. Oomatshini bokusika beLaser baya bethandwa kakhulu ngenxa yokuguquguquka kwabo, ukuguquka ngokukhawuleza kunye nokulungelelaniswa okubalaseleyo kwixesha elifutshane kunye nemveliso yesiko.

Isishwankathelo

Ukusika i-Die yindlela ebanzi kunye neyinkimbinkimbi yokusika, ebandakanya abasebenzi, izixhobo zoshishino, iinkqubo zoshishino, ulawulo kunye nezinye iiprojekthi. Wonke umenzi ofuna ukufa-ukusika kufuneka ahlawule kakhulu, kuba umgangatho wokufa uhambelana ngokuthe ngqo kwinqanaba lemveliso yobugcisa boshishino. Ukusasaza izibonelelo ngokufanelekileyo kunye nokulinga ngenkalipho iinkqubo ezintsha, izixhobo ezitsha kunye nemibono emitsha bubuchule obufunekayo. Ikhonkco elikhulu lemizi-mveliso yeshishini lokusika liyaqhubeka nokuqhuba uphuhliso oluqhubekayo lwawo onke amashishini. Kwixesha elizayo, uphuhliso lwe-die-cutting lubophelelekile ukuba lube ngezenzululwazi kunye nengqiqo.