I-Sandpaper - ukusika kwe-laser kanye nokubhobozwa kwama-disc abrasive sanding

I-Laser iyisixazululo esihlukile sokucutshungulwa kwe-sandpaper ukuze kufezeke izimfuno ezintsha zokucutshungulwa kanye nokukhiqizwa kwamadiski esihlabathi abrasive, angenakufinyeleleka ekusikeni kwendabuko kokufa.

Ukuze kuthuthukiswe izinga lokukhipha uthuli futhi andise ukuphila kwe-sanding disc, izimbobo ezengeziwe futhi ezingcono zokukhipha uthuli zidinga ukukhiqizwa endaweni ethuthukisiwe ye-abrasive disc. Inketho engenzeka yokukhiqiza izimbobo ezincane ku-sandpaper ukusebenzisa iImboni CO₂laser cutting system.

Ukutholakala Kokucubungula I-Laser

Ukucutshungulwa kuyatholakala ku-Sandpaper (Abrasive Materials) nge-CO2 Laser Systems ye-Goldenlaser

I-Laser Cutting

I-Laser Perforation

laser micro perforation of abrasive materials

I-Laser Micro Perforation

Izinzuzo ze-laser cutting for sandpaper:

Ukucutshungulwa kwe-Laser kuqeda isidingo sokusebenza kanzima.

Inqubo ye-laser engathinteki ayibangeli ukuwohloka kwendawo eqhumayo.

Imiphetho yokusika ebushelelezi yediski ye-sandpaper enqunywe nge-laser.

Ukubhobozwa nokusika ekusebenzeni okukodwa ngokunemba okukhulu nesivinini.

Akukho ukugqokwa kwamathuluzi - ikhwalithi yokusika ephezulu ngokungashintshi.

Ama-laser e-CO2 anamandla amakhulu ahlanganiswe nezinhlelo zokunyakaza ze-galvanometer yendawo enkulu anikeza inkundla ekahle yokucubungula ama-sanding disc. Kujwayelekile ukuba nemithombo eminingi ye-laser ukwandisa umkhiqizo.