Laser Die Cutting, Let Die Cutting Ngena Digital Era

Kwishishini lelebhile, iteknoloji yokusika i-laser iphuhliswe yaba yinkqubo ethembekileyo, esebenzayo, kwaye ibe sisixhobo esibukhali samashishini oshicilelo ukutsala abathengi. Kwiminyaka yakutshanje, ngophuhliso oluqhubekayo lokupakisha ukupakisha, itekhnoloji entsha efana nokuprintwa kwedijithali kunye ne-laser teknoloji isetyenziswe ngokubanzi kule ndawo, kwaye isicelo semakethi siye sahlolwa rhoqo.

I-laser die cut cut isetyenziswa kakhulu

Ukusika kweLaser kufazinokusetyenziswa ngokubanzi kwiileyibhile, izincamathelisi, izinto zokuncamathelisa, izinto zokuncamathelisa, iiteyiphu zoshishino, iigaskets, i-electronics, abrasives, shoemaking, njl. umgangatho wemveliso. Kushicilelo lwelebhile, umatshini wokusika ufile ukwindawo ebalulekileyo.

Izinto ezininzi zeelebhile ezifanelekileyolaser die ukusikazivele kwimarike. Izinto ezahlukeneyo zinempendulo engcono kumaza ahlukeneyo kunye neentlobo ze-laser. Inyathelo elilandelayo laser die iteknoloji yokusika iya kuba yindaleko laser frequencies efanelekileyo die ukusika izinto ezahlukeneyo. Inkqubela phambili enkulu yetekhnoloji yokusika i-laser kukukwazi ukulawula ngokuchanekileyo amandla e-laser beam, ngaloo ndlela ithintela ngempumelelo ileyibhile exhasa iphepha ukuba lonakaliswe. Olunye uphuhliso kukulungiswa kwe-laser die-cutting workflow. Ukuze utshintshe ngokukhawuleza ukusuka kwenye into ukuya kwenye ngokusikwa kufa, izinto ezifayo-zinqunyulwe kufuneka ziseke ugcino-lwazi olungaqulathanga kuphela iiparamitha zezinto ngokwazo, kodwa nomgangatho ofanelekileyo wamandla we-laser ofunekayo xa ugawula ezi. izixhobo .

Izinto eziluncedo zokusika laser die

Kwiindlela zemveli zokusika, abaqhubi kufuneka bachithe ixesha ekutshintsheni izixhobo zokusika, kwaye oku kwandisa iindleko zabasebenzi. Kuba iteknoloji yokusika i-laser, abaqhubi banokufumana iingenelo zokutshintsha imilo yokusika kunye nobukhulu nangaliphi na ixesha kwi-intanethi. Ayinakuphikiswa into yokuba i-laser die cut cut inothotho lweenzuzo ngokwexesha, indawo, iindleko zabasebenzi, kunye nelahleko. Ukongeza, inkqubo yokusika i-laser inokudityaniswa ngokulula kunye noshicilelo lwedijithali. Ngokubanzi, njengoshicilelo lwedijithali, ukusika i-laser die kukwafanelekile ukusetyenzwa kwemisebenzi emifutshane.

I-Laser die-cuttingitekhnoloji ayifanelekanga kuphela kwimisebenzi yexesha elifutshane, kodwa ifanelekile kakhulu kwiimveliso ezisanda kuphuhliswa ezifuna ukuchaneka okuphezulu kokufa okanye i-odolo yokutshintsha ngesantya esiphezulu. Oku kungenxa yokuba i-laser die cut cut ayichithi xesha kubumba. Inzuzo enkulu yeteknoloji yokusika i-laser kukuba igcina ixesha lokutshintshwa komyalelo. I-Laser die-cutting inokugqiba ukusika ukufa ukusuka kwimilo enye ukuya kwenye kwi-intanethi ngaphandle kokumisa umatshini. Izibonelelo ezizisayo zezi: iinkampani zokushicilela iileyibhile akusafuneki ukuba zilinde isikhunta esitsha esiziswa kwiplanti yokulungisa, kwaye akusekho mfuneko yokuba zichithe izinto ezingeyomfuneko kwisigaba sokulungiselela.

Ukusika kweLaser kufayindlela yokusika i-fae non-contact ngokuchaneka okuphezulu kunye nokuzinza. Akukho mfuneko yokwenza ipleyiti yokufa, kwaye ayikhawulelwanga ngobunzima bemizobo, kwaye inokufikelela kwiimfuno zokusika ezingenakugqitywa ngumatshini wokusika wendabuko. Ekubeni i-laser die cutter ilawulwa ngokuthe ngqo yikhompyutha, akukho mfuneko yokutshintsha itemplate yemela, enokuqonda ukutshintshela ngokukhawuleza phakathi kwemisebenzi yoyilo eyahlukeneyo, ukugcina ixesha lokutshintsha kunye nokulungelelanisa izixhobo zokusika zemveli. Ukusika ukufa kweLaser kulungele ixesha elifutshane kunye nokusika ukufa komntu.

Ukususela kwiumatshini wokusika i-laserinokugcina inkqubo yokusika ehlanganiswe yikhompyutheni, xa kuveliswa kwakhona, kufuneka kuphela ukubiza inkqubo ehambelanayo yokwenza ukusika, ukuze kuphunyezwe ukuqhutyelwa ngokuphindaphindiweyo. Ekubeni umatshini wokusika i-laser ulawulwa yikhompyutha, unokuqonda ixabiso eliphantsi, ukusika ukufa ngokukhawuleza kunye ne-prototyping.

Ngokwahlukileyo, ixabiso lokusika i-laser die liphantsi kakhulu. Izinga lokugcinwa komatshini wokusika we-laser uphantsi kakhulu. Icandelo eliphambili - i-laser tube, inobomi benkonzo yeeyure ezingaphezu kwe-20,000. Ityhubhu ye-laser nayo ikulungele kakhulu ukubuyisela. Ukongeza kumbane, akukho zixhobo ezahlukeneyo zokusetyenziswa, izixhobo ezincedisayo ezahlukeneyo, iindleko ezahlukeneyo ezingalawulekiyo, kunye neendleko zokusebenzisa umatshini wokusika we-laser uphantse ungabi namsebenzi. I-Laser die-cutting inoluhlu olubanzi lwezixhobo zokusebenza. Izinto ezingezona zetsimbi ziquka ukuzincamathela, iphepha, iPP, i-PE, njl njl. Ezinye izinto zetsimbi, ezibandakanya i-aluminium foil, i-foil yobhedu, njl.

Ixesha lokusika i-laser die liyeza

Inzuzo enkulu ye-laser die cutter kukuba ipateni yokusika inokumiselwa ngokungqongqo phantsi kolawulo lwekhompyutha. Akukho mfuneko yokwenza itemplate, ephelisa inkathazo yokwenza isikhunta semela, kwaye inciphisa kakhulu ixesha lokufa kweesampuli kunye nokuhanjiswa. Ngenxa yokuba i-laser beam ilungile kakhulu, inokusika zonke iintlobo zeegophe ezingenakugqitywa ngumatshini wokufa. Ngokukodwa kunye nophuhliso lweteknoloji yoshicilelo lwedijithali, idityaniswe neebhetshi ezincinci zoshicilelo lwangoku, ukubaleka okufutshane kunye neemfuno zomntu ngamnye, ukusika i-post-press mechanical kusanda ngokungafanelekanga. Ke ngoko, ushicilelo lwasemva kwedijithali olumelwe yitekhnoloji yokusika i-laser yabakho.

Umgaqo osebenzayo wokusika i-laser kukugxininisa amandla kwinqanaba, ukwenzela ukuba inqaku lifakwe ngokukhawuleza ngenxa yokushisa okuphezulu. Iiparamitha ezifanelekileyo ze-laser beam zigcinwe kwinkqubo njengesiseko sokusika izinto zeemilo ezahlukeneyo. Yonke into malungaiteknoloji yokusika i-laseriqala ngesoftware: isoftwe ilawula amandla, isantya, isantya sokubetha kwentliziyo kunye nendawo yelaser beam. Kwisixhobo ngasinye sokunqunyulwa kwe-die-cut, iiparamitha zeprogram ye-laser die-cutting zithe ngqo. Imimiselo ethile yeparameter inokutshintsha umphumo womsebenzi ngamnye, kwaye ngexesha elifanayo linokufumana ukusebenza kakuhle kwemveliso kwinkqubo yokugqiba.

Ukusika i-Laser die kukuqhubekeka kwenkqubo yedijithali, eqala ngomshicileli wedijithali.Ngaphambili, bekunzima ukuba nomfanekiso-ngqondweni wenkampani yoshicilelo yeleyibhile isenza iiodolo zexesha elifutshane ezingama-300 yonke imihla. Kule mihla, ziya zisanda iinkampani zokuprinta iileyibhile ziye zazisa oomatshini bokushicilela bedijithali, kwaye babeke iimfuno ezintsha zesantya sokusika ukufa okulandelayo.Ukusika kweLaser kufa, njengenkqubo ye-post-processing yokushicilela idijithali, yenza abasebenzisi ukuba balungelelanise ngokufanelekileyo imisebenzi kwi-fly-fly, kuba abasebenzisi banokuba nefayile yePDF equlethe yonke inkqubo yokuqhuba umsebenzi.

Digital laser die-ukusika inkquboinokwenza ngokufanelekileyo ukusika ngokupheleleyo, ukusika isiqingatha, ukutyhoboza, ukubhala kunye nezinye iinkqubo ngaphandle kokuphazamiseka kwemveliso. Iindleko zemveliso yeemilo ezilula kunye nezimo ezinzima ziyafana. Ngokwezinga lembuyekezo, abasebenzisi bokugqibela banokulawula ngokuthe ngqo imveliso ephakathi kunye nexesha elifutshane ngaphandle kokugcina inani elikhulu leebhodi zokufa, kwaye banokuphendula kwiimfuno zabathengi ngokukhawuleza. Ngokwembono yokuvuthwa kwetekhnoloji, ixesha letekhnoloji yokusika i-laser lifikile kwaye liyakhula. Kule mihla, amashishini oshicilelo lwelebhile aqala ukuthatha itekhnoloji yokusika i-laser njengenzuzo yokhuphiswano. Kwangaxeshanye, unikezelo lwezinto zokusikwa kwe-laser die lukhula ngokukhawuleza.

Ngexesha loshishino 4.0, ixabiso leteknoloji yokusika i-laser iya kuphononongwa ngokunzulu. Itekhnoloji yokusika iLaser nayo iya kufumana uphuhliso olukhulu kwaye idale ixabiso elingakumbi.

Indawo:https://www.goldenlaser.cc/

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